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06/3 Thick films
We plan to adapt the "classical" strain-sensing thick-film piezoresistive technology to biomechanical applications. This has three main implications, which are the aims of this subproject:
We must adapt / develop thick-film materials that are compatible with high-strength medical alloys such as stainless steels and titanium alloys. This implies a reduction of the "traditional" 850°C firing temperature to below ca. 600°C, in order to limit degradation of the metals by softening, phase transformation and/or oxidation.
A longer-term task is to make progress in moving away from existing lead-based materials (which have to be very carefully shielded from contact with the patient) to environmentally and biologically more benign ones.
Especially for implants, reliable packaging solutions have to be developed to avert degradation of the sensors in the human body and / or adverse body reactions to the sensors.
Last update of project infos on 2009-05-19.
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